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Anisotropic Conductive Adhesive

Substitute material for connectors and ACFs to meet high requirement in precision

Features

  • Quick cure at low temperature
  • Low pressure connection
  • Connectable to lower profile patterns
  • Stable electrical characteristics and high insulation reliability
  • Easy reworkability

Application

用途

Photoimageable Coverlay Film

Photoimageable polyimide film with coexistence of high resolution and excellent bendability

Features

  • Applicable to current PWB photolithography process
  • Excellent heat resistance and bendability
  • High resolution pattern formation with alkaline developing
  • High insulation reliability for electromagnetic interference sheild
  • UL-94 VTM-0 certified product

Application

  • Flexible printed circuits (FPCs)

Photoimageable Interlayer Insulating Materials

Photoimageable insulating materials with high resolution and excellent electrical insulation

Features

  • High resolution

    Via opening below 6μmφ

    6μmφ Via

  • High insulation reliability

    Insulating property above 300 hours (BHAST)

    BHAST cross section view

    Cu mapping image

  • Excellent physical properties

    Tg: 180℃Tensile modulus: 3.5GPa

  • High adhension

    Sputtering wiring adhesion above 6N/cm

  • Developable in alkaline aqueous solution

  • Dry film-type

Application

  • Build-up boards, interposers, redistribution layer of wafer level packages

Stretchable Conductive Paste

Electro-conductive material for Stretchable electronics

Features

  • Low temperature process
  • Screen printable
  • Highly stretchable conductors on elastic film substrates
  • No crack after stretching
  • Electrical conductivity is maintained after at stretching

Application

Stretchable conductors of electronic devises for "Wearable market", where "Stretchability" is required.