Substitute material for connectors and ACFs to meet high requirement in precision
- Quick cure at low temperature
- Low pressure connection
- Connectable to lower profile patterns
- Stable electrical characteristics and high insulation reliability
- Easy reworkability
Photoimageable polyimide film with coexistence of high resolution and excellent bendability
- Applicable to current PWB photolithography process
- Excellent heat resistance and bendability
- High resolution pattern formation with alkaline developing
- High insulation reliability for electromagnetic interference sheild
- UL-94 VTM-0 certified product
Flexible printed circuits (FPCs)
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TDS
（117KB）
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Analysis Report of RoHS
（339KB）
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Analysis Report of Halogen
（312KB）
Photoimageable insulating materials with high resolution and excellent electrical insulation
Features
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●High resolution
Via opening below 6μmφ
6μmφ Via
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●High insulation reliability
Insulating property above 300 hours （BHAST)
BHAST cross section view
Cu mapping image
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●Excellent physical properties
Tg： 180℃Tensile modulus： 3.5GPa
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●High adhension
Sputtering wiring adhesion above 6N/cm
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●Developable in alkaline aqueous solution
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●Dry film-type
Build-up boards, interposers, redistribution layer of wafer level packages
Electro-conductive material for Stretchable electronics
- Low temperature process
- Screen printable
- Highly stretchable conductors on elastic film substrates
- No crack after stretching
- Electrical conductivity is maintained after at stretching
Stretchable conductors of electronic devises for "Wearable market", where "Stretchability" is required.
Photo-imageable White Dry Film Solder Resist that obtains optimum high-reflection for Mini LED board.
- High Reflectivity in visible light areas
- Response to Direct image exposure
- Excellent surface flatness and uniformity of high reflection
- Stable reflectivity even when exposed to Blue LED
PCB For Mini LED, LED Backlight, LED lighting