TAB (Tape Automated Bonding)
A technology whereby a circuit is etched onto heat-resistant film coated with copper foil, and a semiconductor chip is attached via bumps.
Thermal Drying Solder Resist
A type of solder resist that is applied by adding heat to evaporate organic solvents. Thermal drying solder resists are used in some etching resists.
Thermally Curable Solder Resist
A type of solder resist that hardens when heat is applied.
Holes that are drilled through electrical insulation material and make conduction between conductors on the top and bottom possible by means of copper plating. Through holes serve as a way of interconnecting conductors, and as locations where components leads are inserted and attached by soldering or other means.
UV Curable Solder Resist
A type of solder resist that hardens under UV light.
A through hole or plated through hole in a printed circuit board that enables electrical connections to be made between layers. "Via hole" refers to a through hole that component leads are not inserted into.