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TAB (Tape Automated Bonding)
A technology whereby a circuit is etched onto heat-resistant film coated with copper foil, and a semiconductor chip is attached via bumps.
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Thermal Drying Solder Resist
A type of solder resist that is applied by adding heat to evaporate organic solvents. Thermal drying solder resists are used in some etching resists.
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Thermally Curable Solder Resist
A type of solder resist that hardens when heat is applied.
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Through Hole
Holes that are drilled through electrical insulation material and make conduction between conductors on the top and bottom possible by means of copper plating. Through holes serve as a way of interconnecting conductors, and as locations where components leads are inserted and attached by soldering or other means.
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UV Curable Solder Resist
A type of solder resist that hardens under UV light.
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Via/Via Hole
A through hole or plated through hole in a printed circuit board that enables electrical connections to be made between layers. "Via hole" refers to a through hole that component leads are not inserted into.