Glossary

T-Z

  • TAB (Tape Automated Bonding)
    A technology whereby a circuit is etched onto heat-resistant film coated with copper foil, and a semiconductor chip is attached via bumps.
  • Thermal Drying Solder Resist
    A type of solder resist that is applied by adding heat to evaporate organic solvents. Thermal drying solder resists are used in some etching resists.
  • Thermally Curable Solder Resist
    A type of solder resist that hardens when heat is applied.
  • Through Hole
    Holes that are drilled through electrical insulation material and make conduction between conductors on the top and bottom possible by means of copper plating. Through holes serve as a way of interconnecting conductors, and as locations where components leads are inserted and attached by soldering or other means.
  • UV Curable Solder Resist
    A type of solder resist that hardens under UV light.
  • Via/Via Hole
    A through hole or plated through hole in a printed circuit board that enables electrical connections to be made between layers. "Via hole" refers to a through hole that component leads are not inserted into.