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Glossary

A-B

  • Alkaline Developable Solder Resist
    Indicates developable solder resist that uses an alkaline aqueous solution as a developer. It is more environmentally-friendly than other developable masks (e.g. solvent developable masks).
  • BGA (Ball Grid Array)
    An integrated circuit package that enables high-density mounting. A surface-mounted package that employs solder balls arranged in a grid pattern on its underside as connection terminals for printed wiring boards.
  • Black Stripe
    Black bands within the panel that reduce the reflection of external light. Black stripes ensure that black colors appear crisp and clear, and provides sharp images with good contrast. Also referred to as "black matrix".
  • Build-up Board
    A high-density printed wiring board consisting of a core (base) board on top of which conductive and insulating layers are laid alternatively.
  • Build-up Method
    A method used to create high-density printed wiring boards by layering conductive layers and insulating layers on top of one another on a core (base) board.

C-E

  • Coverlay
    A protective cover with insulating properties used only on flexible printed wiring boards. In the same way as solder resist, circuits necessary for connections can be selectively exposed, while other circuits are protected from dust and moisture. The film type is generally referred to as "coverlay film" and the liquid type as "coverlay ink" or "overcoat".
  • CSP
    (Chip-Size Package/Chip-Scale Package)
    A generic term for packages that are the same size as, or slightly larger than, a chip.
  • Curtain Coat
    A method in which low-viscosity solder resist is dropped in a curtain and boards are passed through it, covering the entire surface of the board in solder resist.
  • Developable Solder Resist
    A solder resist capable of forming microscopic circuit patterns by exposing and developing negative film with a circuit pattern onto a printed wiring board, in order to make microscopic circuit patterns on printed wiring boards.
  • Electrode Material
    Material in the form of a paste that is used to create the electrodes that are formed on the front and rear substrates of plasma display panels.
  • Electroless Plating
    A method that employs a chemical reaction to plate insulators. There are two methods: one in which metallic ions in the plating solution are reduced and separated by means of a reducing agent, and another in which metals in the plating solution are displaced and separated by the item to be plated.
  • Etching
    Refers to the process whereby unnecessary parts are removed from conductors on an insulated board by either chemical or electrochemical means, when forming conductor patterns.

F-M

  • Flexible Printed Wiring Board
    A soft, flexible board made from polyester or polyimide film coated with copper foil.
  • FPD (Flat Panel Display)
    A generic term for liquid crystal displays (LCDs), plasma display panels (PDPs), and other flat panel displays.
  • Halogen Free
    Inks that do not contain dioxin-producing halogens, such as chlorine or bromine (JPCA Standard ES01-2003. Max. permissible level of chlorine/bromine: 900 ppm. Max. permissible total: 1,500 ppm).
  • ISO 14000 Series
    An international standard that regulates requirements for environmental management systems aimed at the reduction and prevention of significant environmental risks and environmental impact imposed, or indirectly imposed, by the activities, products, or services of organizations.
  • Legend Ink
    An ink that is printed onto the surface of printed wiring boards in order to indicate names, specified positions, and other information relating to mounted electronic components.
  • Mother board
    A printed wiring board embedded in electronic devices that contains LSI circuits, resistors, capacitors, and other components in a single unit.
  • Multilayer Printed Wiring Board
    A printed wiring board that contains insulating layers sandwiched between three or more conductive layers. Multilayer boards allow connections to be formed mutually between arbitrary conductive layers, and between terminals of mounted electrical components and arbitrary conductive layers.

P-Q

  • Package Board
    (Module Board)
    A type of printed wiring board used as an interposer when mounting semiconductors such as computer CPUs or memory.
  • PDP (Plasma Display Panel)
    The glass panels used in PDP TVs. PDPs are constructed from two thin glass panels between which rare gases are injected. Light and color can be emitted by adding a voltage to the gas and focusing the ultraviolet rays thereby produced onto fluorescent material.
  • PGA (Pin Grid Array)
    An insertable package with external connecting pins arrayed in a grid pattern on its underside.
  • Photo Via Hole
    A blind via hole formed by exposure and development using a photomask and coated with a photosensitive insulating layer. This technique improves productivity because it allows batch formation of miniature diameter via holes.
  • Plastic Package
    Packages (modules) with base materials made of plastics such as glass epoxy.
  • Plating Mask
    A solder resist that is used on areas that do not require plating (i.e. areas excluding the pattern) in the patterning and plating processes. Ink or dry film are used as plating masks, and are removed after plating is completed.
  • PWB (Printed Wiring Board)
    A board consisting of a conductive wiring pattern formed on an insulated board via chemical means such as plating or etching, or via conductive paste.
  • QS 9000
    An international quality standard developed by the "Big Three" US automakers. QS 9000 is based on the ISO 9001 standard, but also incorporates items specific to the automobile industry.

R-S

  • Rigid Boards/Rigid PWBs
    Printed wiring boards that employ insulating boards made of hard materials.
  • Screen Print
    A method of transparent printing whereby a fabric cloth (the screen) is placed on top of the board and solder resist applied to the screen is printed onto the board by applying pressure using a rubber board known as a "squeegee".
  • Solder Leveler
    A thin film of solder that is applied to through holes and copper pads on the surface of printed wiring boards to prevent oxidization. Also referred to as "pre-solder".
  • Solder Resist
    A heat-resistant coating material that is applied to certain areas on printed wiring boards, making it impossible for solder to adhere to these areas during soldering.
  • Spray Coat
    A method whereby solder resist that has been adjusted to a viscosity suitable for coating is atomized using a spray gun and sprayed onto the board to produce a membrane. Various methods exist, including airless spraying, air spraying, and rotational bell spraying.

T-Z

  • TAB (Tape Automated Bonding)
    A technology whereby a circuit is etched onto heat-resistant film coated with copper foil, and a semiconductor chip is attached via bumps.
  • Thermal Drying Solder Resist
    A type of solder resist that is applied by adding heat to evaporate organic solvents. Thermal drying solder resists are used in some etching resists.
  • Thermally Curable Solder Resist
    A type of solder resist that hardens when heat is applied.
  • Through Hole
    Holes that are drilled through electrical insulation material and make conduction between conductors on the top and bottom possible by means of copper plating. Through holes serve as a way of interconnecting conductors, and as locations where components leads are inserted and attached by soldering or other means.
  • UV Curable Solder Resist
    A type of solder resist that hardens under UV light.
  • Via/Via Hole
    A through hole or plated through hole in a printed circuit board that enables electrical connections to be made between layers. "Via hole" refers to a through hole that component leads are not inserted into.