Features: White Dry Film Solder Resist is designed to be used by direct image exposure for LED substrates. Unlike conventional sheet type reflective plates of Hole processed by punch, it can contribute to finer pattern such as small pad size and narrow pitch of LED mounting thanks to Photo-imageable type. Also, this material can obtain high reflectivity, so that it can keep visible light area stable even when exposed to LED light for a long time.

How to use: Peeling the Cover film → Vacuum laminator → Peeling the Carrier film → DI exposure → Development with Alkali → Main Curing(Thermal, UV)